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테이핑 및 검사
전자부품 출하 검사 및 포장 자동화 솔루션은 대한민국 정부의 스마트공장 (Smart Factory) 고도화 사업을 실현하는 핵심 요소입니다. 당사의 자동 SMD 테이핑 머신 (SMD Taping Machine) 및 자동 광학 검사 장비(AOI)는 초고속 고정밀 처리를 통해 전자 부품 및 정밀 초소형 부품의 100% 품질 검사와 완벽한 릴(Reel) 포장을 보장합니다. 본 장비는 고정밀 하드웨어와 머신비전 알고리즘 기반의 자체 소프트웨어를 결합하여 납땜 불량, 크랙, 역삽 (극성 오류) 등 미세 결함과 치수·방향 오차를 실시간으로 검출함으로써, Tier-1 및 Tier-2 고객사의 SMT 공정 내 불량 유입을 근본적으로 차단합니다. 부산·김해·울산 등 동남권 산업단지를 중심으로 신속한 기술 지원과 로컬 엔지니어링을 포함한 턴키 솔루션을 공급하여, 제조 현장의 인건비 절감, 심각한 구인난 해소, 고객사 품질 감사 완벽 대응을 강력하게 지원합니다.
  • LED 웨이퍼 검사 및 소팅 장비
    LED Wafer Testing & Sorting Machine
    Details
  • LED 소팅 장비
    LED Sorting Machine
    Details
  • LED 테이핑 머신
    LED Taping Machine
    Details
  • LED 표면 실장기
    LED Surface Mounter
    Details
  • 반도체 조립 및 테스트 장비
    Semiconductor Assembly & Testing Equipment
    Details
  • 수동소자 실장 및 검사 장비
    Passive Element Assembly and Testing Equipment
    Details
  • 지능형 검사 장비
    Intelligent Detection Equipment
    Details
  • LED 3D 접착제 고정밀 AOI 검사기
    LED 3D Adhesive High AOI Machine
    Details
Normal Chip Probe station
LED Wafer Testing & Sorting Machine
일반 칩 프로브 스테이션 (Normal Chip Probe Station)은 일반 LED 칩 및 CSP LED의 자동 테스트를 위해 개발된 장비입니다. 본 장비는 일체형 액티브 에지 프로브 (Active Edge Probe)를 탑재하고 있으며, 멀티 니들 프로브를 칩에 접촉시켜 효율적인 테스트를 수행할 수 있습니다.
장비는 합리적인 구조 설계를 채택하여 높은 테스트 정확도를 제공하며, 자체 연구·개발한 테스터(Tester)와 ESD 테스터를 적용하였습니다. 또한 수입 정밀 스크류 및 가이드 레일을 사용하여 안정적인 운전 성능을 보장합니다. 조작과 디버깅이 편리하여 생산성과 작업 효율을 향상시킬 수 있습니다.


Item

Specification

Item

Specification

Store object

Normal LED chip, CSP LED

Chip size

4x5mil-60x60mil

Edge detector

Active edge finder

Probe number

2, 4, 6, 8 stitches available

Working size

4inch 1.2 times expansion film Effective point measurement range:135mm

Operating stroke

X:170mm Y:320mm

XYZ axis

XY axis：Repeatability≤3μm， Z axis：12mm Itinerary repeatability≤3μm

θ axis

Rotation Angle：±20°，Precision：＜0.0003°

XY perpendicularity

≤ 5um

Integrating sphere

2 inch point ball

Flatness of working disk

Center 5 inches ≤ 10um, outer ring ≤ 15um

Fixture

7 inch female ring, 6 inch DISCOring

Weight

500Kg

Self-cleaning probe

Sharpen and clean the needle

Power supply

AC220V±10%

Dimension

790mmX1130mmX1860mm

Flip Chip Probe station
LED Wafer Testing & Sorting Machine
The flip-chip probe station is an automatic test device for flip-LED chips independently developed by Standard Spectrum. It is equipped with an integrated active edge probe, which can be efficiently tested by inserting a multi-needle probe into the chip. The equipment can detect 3x3mil-120x120mil chip, standard 4-inch compatible 6-inch chip disk, with self-developed tester, ESD tester and imported precision screw


Item

Specification

Item

Specification

Store object

LED Flip chip

Chip size

3x3mil-120x120mil

Edge detector

Active edge finder

Probe number

Up to 20 stitches can be customized

Working size

Standard 4-inch chip disk, compatible with 6- inch chip disk

Operating stroke

X-axis:210mm Y-axis440mm

XYZ axis

Repeated positioning accuracy ≤3um

Needle mark observation

Independent needle mark observation

Self-cleaning probe

Sharpen and clean the needle

Integrating sphere

The 2-inch integrating ball automatically switches 12 gears

Flatness of working disk

10um

Fixture

7 "child ring, 6" DISCO ring

Weight

900Kg

Grating scale

Reserved installation

Power supply

AC220V±10%

Dimension

1150mmX850mmX1780mm

LED Wafer Sorting Machine
LED Wafer Testing & Sorting Machine
LED wafer sorting machine is a fully automated equipment for sorting LED chips, which is configured after the LED chip point measuring machine process, and the LED chip is sorted from the photoelectric test parameter results obtained from the LED chip point measuring machine. This equipment is equipped with a software system, which has the advantages of strong stability, easy maintenance, and easy operation. It is an indispensable and important equipment in the production process of LED chip.


Item

Specification

Item

Specification

Store object

LED/ MiniLED wafer

Chip size

4x5mil-60x60mil

XY axis accuracy

Active edge finder

Capacity

Cycle time:65ms, Comprehensive capacity>900K/day

Working size

4inch 1.2 times expansion film Effective point measurement range:135mm

Operating stroke

X:170mm Y:320mm

Wafer size

XY axis：Repeatability≤3μm， Z axis：12mm Itinerary repeatability≤3μm

Tray size

Rotation Angle：±20°，Precision：＜0.0003°

Input/output cartridge≤

Integrating sphere

Solid strength

15~100g（spring force）

Flatness of working disk

Center 5 inches ≤ 10um, outer ring ≤ 15um

Vacuum

<-70kpa

Weight

500Kg

Power

2Kw

Power supply

AC220V±10%

Dimension

1020mm*1090mm*1810mm

LED Basics Sorting Machine
LED Sorting Machine
LED basic sorting machine Fully automated equipment developed for SMD LED spectroscopic test and classification. The machine adopts PLC control system, the LED material passes through the spectroscopic test station, and finally falls into the bucket of different BIN number according to the spectroscopic test data. The device can flexibly customize the number of bins, and supports a maximum of 120 Bin bins.


Item

Specification

Item

Specification

Store object

SMD LED

Operating speed

30k/h

BIN recovery rate

≥97%

Position accuracy

0.01mm

Sort system

BPSS-31 (option BPSS-61)

Bin quantity

19

First pass yield

≥99%

MTBA

≥60min

Weight

320Kg

Power

0.8kW

Power supply

AC220V±10%

Dimension

1000mmX700mmX2200mm

LED Fast Sorting Machine
LED sorting Machine
The LED Fast sorting machine is an automated device developed for SMD LED beam splitting test and classification. The equipment adopts PLC control system, the LED will pass through the positioning correction, spectrophotometer test station, color test station, classification and unloading station, NG discharge station, etc., and finally the LED material will fall into the bucket of different BIN number according to the spectrophotometer test results. The device can flexibly customize the number of bins, and supports a maximum of 19 Bin dispensing buckets.

Item

Specification

Item

Specification

Store object

SMD LED

Operating speed

100k/h

BIN recovery rate

≥97%

Position accuracy

0.01mm

Sort system

BPSS-31 (option BPSS-61)

Bin quantity

19

First pass yield

≥99%

MTBA

≥60min

Weight

320Kg

Power

0.8kW

Power supply

AC220V±10%

Dimension

1000mmX700mmX2200mm

LED Double Fast Sorting Machine
LED Sorting Machine
The LED double fast sorting machine is a fully automated device developed for SMD LED beam splitting test and classification, which is more efficient than a single-head beam splitting machine, saving energy, cost and space. The machine adopts the dual optical splitting workstation mode and PLC control system, through the high-speed vibration disk to orderly inhale the materials of the left and right optical splitting station disc guide disk, and finally the LED materials according to the optical splitting test results, respectively into the different BIN number of the barrel.


Item

Specification

Item

Specification

Store object

SMD LED

Operating speed

140k/h

BIN recovery rate

≥97%

Position accuracy

0.01mm

Sort system

BPSS-31 (option BPSS-61)

Bin quantity

19*2

First pass yield

≥99%

MTBA

≥60min

Weight

450Kg

Power

1.5kW

Power supply

AC220V±10%

Dimension

1420mmX760mmX1850mm

LED disc sorting machine
LED sorting Machine
The machine adopts PLC control system, and the materials are sucked into the disc guide plate in an orderly manner through the high-speed vibration disc. With the rotation of the guide disc, the LED passes through the positioning correction, the splitting test station, the color test station, the sorting and discharging station, the XY dividing platform, the NG discharging station, etc. Finally, the LED materials are dropped into the bucket with different BIN numbers according to the splitting test results. The device supports a maximum of 120 Bin bins, and other bins can be customized flexibly.

Item

Specification

Item

Specification

Store object

SMD LED

Operating speed

20k/h

BIN recovery rate

≥97%

Position accuracy

0.01mm

Sort system

BPSS-31 (option BPSS-61)

Bin quantity

120

First pass yield

≥99%

MTBA

≥60min

Weight

450Kg

Power

1.0kW

Power supply

AC220V±10%

Dimension

1080mmX790mmX1850mm

LED Small Material Disc Sorting Machine
LED Sorting Machine
The machine adopts PLC control system, the feed disc of the high speed vibration disk is transferred to the main turntable, and the material is corrected and tested through the correction station through the intermittent rotation of the main turntable. It has the characteristics of stability, efficiency and simplification, and can meet the requirements of most packaging enterprises to improve the production capacity of small materials.

Item

Specification

Item

Specification

Store object

small size LED

Operating speed

72k/h

BIN recovery rate

≥97%

Position accuracy

0.01mm

Sort system

BPSS-31 (option BPSS-61)

Bin quantity

33

First pass yield

≥99%

MTBA

≥60min

Weight

350Kg

Power

1.0kW

Power supply

AC220V±10%

Dimension

1100mmX740mmX1960mm

LED Sorting & Taping Machine
LED Taping Machine
The machine is a fully automated device developed by Biaopu for SMT LED sorting, testing and taping. The advantages of this device are:
① High speed: the sorting and taping functions can operate independently, and the speed is greater than 70K/H;
② High efficiency: splitting and braiding at the same time, improve efficiency, reduce power consumption, save labor;
③ Save space: occupy a small area, save space costs

Item

Specification

Item

Specification

Store object

SMD LED

Operating speed

70k/h

BIN recovery rate

≥98%

Vibration Feeder

BPE-21

Sort system

BPSS-31 (option Keyence)

Bin quantity

9

First pass yield

≥99%

MTBA

≥60min

Weight

320Kg

Power

1.5kW

Power supply

AC220V±10%

Dimension

1500mmX1100mmX2000mm

LED Basic Taping Machine
LED Taping Machine
The machine adopts PLC control system, the materials transported by the high-speed vibration feeder are transported through he CAM turret to the positioning station 1, the test station, the rotating station, the positioning station 2, and then to the loading place, and the SMD LED is put into the carrier belt according to the preset packaging direction for hot pressing tape packaging.

Item

Specification

Item

Specification

Store object

SMD LED

Operating speed

60k/h

Belt size

8mm (optional：12mm,16mm)

Electrical detection

BPE-21

Material feeding mode

Vibration Feeder

Supplementary material mode

Automatic replenishment

Tape sealing system

Repeated hot pressing type

Image system

BPI-31(optional：Keyence）

First pass yield

≥99%

MTBA

≥30min

Weight

420Kg

Power

1.0kW

Power supply

AC220V±10%

Dimension

1450mmX700mmX2200mm

LED Disc Taping Machine
LED Taping Machine
The machine adopts PLC control system, the material transported by the high-speed vibration feeder is transported to the positioning test station, rotating station, material detection station through the vacuum nozzle of the disc indexing plate, and then to the loading place, and the material is put into the load belt according to the preset packing direction for hot pressing packaging.

Item

Specification

Item

Specification

Store object

SMD LED

Operating speed

80k/h

Belt size

8mm (optional：12mm,16mm)

Electrical detection

BPE-21

Material feeding mode

Vibration Feeder

Supplementary material mode

Automatic replenishment

Tape sealing system

Repeated hot pressing type

Image system

BPI-31 (option Keyence)

First pass yield

≥99%

MTBA

≥30min

Weight

300Kg

Power

0.7kW

Power supply

AC220V±10%

Dimension

1400mmX1050mmX2000mm

LED Double Disc Taping Machine
LED Taping Machine
The machine adopts PLC control system, the materials transported by the high-speed vibration feeder are transported through he CAM turret to the positioning station 1, the test station, the rotating station, the positioning station 2, and then to the loading place, and the SMD LED is put into the carrier belt according to the preset packaging direction for hot pressing tape packaging.

Item

Specification

Item

Specification

Store object

SMD LED

Operating speed

80k/h

Belt size

8mm /12mm /16mm

Electrical detection

BPE-21

Material feeding mode

Vibration Feeder

Supplementary material mode

Automatic replenishment

Tape sealing system

Repeated hot pressing type

Image system

BPI-31(optional：Keyence）

First pass yield

≥99.5%

MTBA

≥30min

Weight

700Kg

Power

1.5kW

Power supply

AC220V±10%

Dimension

1963mmX870mmX1995mm

LED Blue Film Taping Machine
LED Taping Machine
The machine adopts PLC control system to absorb the components of the blue film disc to the implant machine purchase, and finally the material braid to complete the packaging. Compared with the structure of other forms of braiding machine, blue film braiding machine has the advantages of high protection of materials, compatible material sizes and so on.

Item

Specification

Item

Specification

Store object

SMD LED

Operating speed

20k/h

Belt size

8mm (optional：12mm,16mm)

Belt image

130W pixel

Material feeding mode

6 inch blue film disc

Retrieval image

130W pixel

Positioning accuracy

0.01mm

Image system

Biaopu

First pass yield

≥99%

MTBA

≥30min

Weight

400Kg

Power

1.5kW

Power supply

AC220V±10%

Dimension

1420mmX760mmX1850mm

Bulk LED Surface Mounter
LED Surface Mounter
Bulk LED Surface Mounter Developed for LED mounting automation equipment, it is configured after the dispensing machine or screen press, by moving the mounting head to place the surface mount components accurately on the PCB pad. It adopts industrial computer control system, dual vibration disk automatic feeding, 5 visual material inspection, multi-row of nozzle patch and other powerful configuration, with stable and reliable, high-speed and efficient, precise patch, low power

Item

Specification

Item

Specification

Store object

SMD LED

Operating speed

100k/h

Position mode

Mechanical correction, visual positioning

Positioning accuracy

≤±50μm

Image system

Independently developed by Biaopu

PCB compatible size

192*192，128*256，256*256，160*320，250*250

First pass yield

≥99.7%

MTBA

≥60min

Weight

1800Kg

Power

2.0kW

Power supply

AC220V±10%

Dimension

1700mmX1200mmX1520mm

Semiconductor Sorting Machine-Turret Type
Semiconductor Assembly & Testing Equipment
Turret sorter is used for semiconductor chip fully automated testing, sorting, taping machine, this equipment adopts industrial computer control system combined with motion control card, through the standard spectrum independent research and development of efficient and stable vibration disk to transport materials to the turret, and then the material through the test station will be bad after screening, finally braid.

Item

Specification

Item

Specification

Store object

SOT23-25-26, SOT89, SOD123, SOD323, SOD523, MSOP8/10, SOP8/7, TSSOP

Operating speed

~45k/h

Main turret

D motor drive, repeated positioning accuracy

Test station

Supports up to 8 test stations

Control system

Industrial computer + motion control card

Direction judgment

Vision, polarity test (1 / all)

Loading method

Vibration Feeder

Contact type

Shrapnel/probe type

Image system

In-band detection/Print detection /3D5s pin Detection/Direction Detection (optional)

Laser printing subdisk

4 suction cups, optional marking machine

Air source

4-7Bars 150-250NL/min

Communication interface

TTL/GPIB

Weight

1000Kg

Power

3.0kW

Power supply

AC220V±10%

Dimension

1700mmX1400mmX1900mm

Semiconductor Sorting Machine-Turret Type
Semiconductor Assembly & Testing Equipment
The turret sorter F20 is an integrated machine for fully automated testing, sorting and taping of semiconductor chips such as SOT and filters. The equipment has stable performance, high repeatable positioning accuracy, flexible customization and expansion of test station functions, and convenient maintenance in the later period.

Item

Specification

Item

Specification

Store object

SOP series, filter chip series

Operating speed

~20k/h

Main turret

DD motor drive, repeated positioning accuracy

Test station

Supports up to 8 test stations

Control system

Industrial computer + motion control card

Sorting box

4Bin/8Bin(optional)

Loading method

Vibration Feeder

Contact type

Shrapnel/probe type

Image system

In-band detection/Print detection /3D5s pin Detection/Direction Detection (optional)

Laser printing subdisk

4 suction cups, optional marking machine

Air source

4-7Bars 150-250NL/min

Communication interface

TTL/GPIB

Weight

1000Kg

Power

3.5kW

Power supply

AC220V±10%

Dimension

1700mmX1400mmX1900mm

Semiconductor Sorting Machine-Translation Type
Semiconductor Assembly & Testing Equipment
Translation type separator is the spectrum of independent research and development for the QFN, QFP, BGA, the LGA, PLCC, TSOP, CSP, PSA and other small size precision chip fully automated testing, sorting machine. High operating efficiency, up to 13K/H, can detect 2x2mm to 50x50mm chip size range; Modular design equipment can be flexibly customized and later expanded test station functions, and maintenance is convenient and fast, greatly improving productivity efficiency

Item

Specification

Item

Specification

Store object

QFN,QFP,BGA,LGA,PLCC,TSOP，CSP,PSA, etc

Compatible chip size

2X2mm~50X50mm

Standard

1est moed: 8-site(4x2) 4-site(2x2，4x1) 2-site(4x2) 1-site(4x2)

Contact Force

240kg

Pick up Head

2x4

UPH

Max. 13,000

Index Time

Mix. 420

JAM Rute

<1/10000

Tray

JEDEC

Test area

299mm x 147 mm

Air source

>0.5Mpa，>600L/min

Temperature control range

+50degC to +90degC ±2degC+90degC to +150degC ±3degC

Weight

1500Kg

Power

6.0kW

Power supply

AC220V±10%

Dimension

2000mmX1550mmX2000mm

Semiconductor Film Taping Machine-Translation Type
Semiconductor Assembly & Testing Equipment
The machine is independently developed by Standard Spectrum, which is suitable for automatic testing, sorting and braid of wafer chips. The machine adopts industrial computer + motion board control action, stable and reliable operation; CCD visual positioning, combined with XYθ position can be quickly compensated, high mounting accuracy; The turret mechanism is driven by DD motor, and the 12-station Torlon4203/ rubber suction nozzle can realize the requirement of high-speed braided tape. The suction nozzle is fixed by screw, which is convenient for quick replacement of different types of products, with high compatibility; Feature rich, standard configuration includes automatic loading and unloading assembly, Xy-θ platform assembly, WF vision assembly, thimble assembly, 20- station main turntable, gripper rotation/calibration assembly, bottom vision assembly, NG cartridge assembly, electrical test assembly, braid assembly

Item

Specification

Item

Specification

Store object

QFN,QFP,BGA,LGA,PLCC,TSOP，CSP,PSA, etc.

Operating speed

~20k/h

Wafer-Table XY,θ

DD motor drive, repeated positioning accuracy

Repeated positioning

XY axis:≤5μm

Nozzle positioning accuracy

Industrial computer + motion control card

X,Y perpendicularity

≤10μm

Wafer-Table

Vibration Feeder

Blue film can work range

Max. Ø120mm

Air source

0.5~0.7MPa,50L/min

Applicable belt width

8mm~12mm

Weight

1300Kg

Negative pressure

<-80Kpa

Power supply

AC220V±10%

Dimension

1300mmX1100mmX1970mm

Semiconductor Sorting Machine-Tubular Type
Semiconductor Assembly & Testing Equipment
This equipment is developed for automatic detection and sorting equipment for To-220/220F/220AB/220CB,To-247, To- 251/252,To-262, To-263 and other large size chips. It has three advantages: high efficiency and high yield, high compatibility and template design.

Item

Specification

Item

Specification

Store object

To-220/220F/220AB/220CB,To-247, To-251/252,To-262,To-263

Operating speed

≥10K/H

Main turret

DD motor drive, repeated positioning accuracy Less than or less than 10um, 20 mouthpieces

Test station

Customizable, supports up to 8 test stations

Control system

Industrial computer + motion control card

MTBF

≥168H

Loading method

Multiple tube feeding

MTBA

≥60min

Image system

Print detection /3D5s pin detection

Laser printing subdisk

Secondary disk The value can be 6/9/12 sucker bits

Air source

5-7Bars 480-600NL/min

Communication interface

TTL/GPIB

Weight

1200Kg

Power

4.0kW

Power supply

AC220V±10%

Dimension

2209mm×2007mm×1890mm

DFN Chip Taping Machine
Semiconductor Assembly & Testing Equipment
This equipment is developed for DNF chip automatic test braid equipment. This machine adopts PLC control system, the chip is transported to the disc indexing disc through an efficient and stable vibration disc, and then the material is tested by the test station. According to the test result, the defective product is first eliminated, and then the good product material is put into the carrier belt according to the set direction by the implant mechanism, and finally the hot pressing film and the carrier belt are repeatedly braided to complete the packaging.

Item

Specification

Item

Specification

Store object

DFN semiconductor chip

Operating speed

DFN0603≥1200Pcs/min

Component size

0603-1608

Image system

Up to 5 stations vision system

Loading method

Vibration Feeder

Test system

Two sets of test stations

Lifting force

16-60gf

Laser marking

Visual positioning marking

Disengaging

Automatic troubleshooting

NG classification

9 Bin

Weight

300Kg

Sealing mode

Repeated hot pressing

Power supply

AC220V±10%

Dimension

980mm*750mm*1630mm

Passive Component Taping Machine
Passive Element Assembly and Testing Equipment
The passive component taping machine is independently developed by Standard spectrum for automatic testing and packaging equipment of passive components such as resistance, capacitance and inductance. This machine adopts PLC control system, the passive component material is transported to the disc indexing disc through an efficient and stable vibration disc, and then the material is separated, reverse material inspection, electrical testing, appearance detection, bad product discharge, and then the good material is put into the carrier belt according to the set direction by the implant mechanism, and finally the hot pressing film and the carrier belt are repeatedly braided to complete the packaging.

Item

Specification

Item

Specification

Store object

Chip components such as resistors/inductors/capacitors/fuses

Operating speed

Max.5300Pcs/min

Component size

01005-2512

Image system

Up to 3 stations vision system

Feeding mode

Vibration Feeder

Test station

Four-wire test (bottom test possible)

Lifting force

16~60gf

Test instrument

Optional：HIOKI,ADEX,AGLLENT

Disengaging mechanism

Automatic troubleshooting

Supporting equipment

Punch holes, tape winder

Air source

4-7Bars 150-250NL/min

Sealing mode

Repeated hot pressing

Weight

300Kg

Power

1.5kW

Power supply

AC220V±10%

Dimension

960mm x 670mmx 1830mm

Six surface inspection machine
Intelligent Detection Equipment
The six-side appearance inspection machine is an automatic equipment developed by Standard spectrum for the inspection of appearance defects of LED, passive components and other regular products. The machine adopts motion control acquisition card, through the vibration disk through the guide block to make the material orderly arranged on the high-permeability glass turntable, andthrough the 6 high-speed cameras at a constant speed to take pictures of the 6 faces of the product, the use of deep learning andAI algorithm to identify and classify OK and NG materials, and finally blow through the high-speed solenoid valve to the corresponding receiving box to complete automatic inspection.

Item

Specification

Item

Specification

Adaptive element

Chip capacitors, inductors, resistors, leds

Operating speed

LED 0603:180K/H capacitance: 0402:600K/Hinductance 2520:90K/H

Missing rate

≤0.03%

Misjudgment rate

≤0.08%

Test item

Bubbles, impurities, inverted line, overflow, glue, glue diffusion, poor surface, cutting bias, mold bias, first welding bias, second welding bias, Polar hole overflow, residual film, burr, incoming material blackening, leakage, welding

Bin quantity

4~6 BIN

Operating efficiency

98%

Temperature

18℃～32℃

Humidness

25%～60%

Air source

0.4MPa-0.6MPa

Air cleanliness

Lv.5

Weight

500Kg

Power

1.0kW

Power supply

AC220V±10%

Dimension

1055mm*958mm*1900mm

LED 3D Adhesive High AOI Machine
LED 3D Adhesive High AOI Machine
LED whole board 3D adhesive height detector is used to detect the colloidal height of LED stand after dispensing, through laser scanning technology, can quickly and accurately detect the LED adhesive surface height difference of automatic equipment. The machine adopts PLC+PC system, pushes the material layer by layer into the 3D camera detection position through the synchronization belt and module structure, transmits the collected data to the laser system, marks the defect position, and takes pictures with the camera to detect the accuracy of the laser. The detection system can automatically classify the type and quantity of defects and the production capacity of the whole machine. After the laser is finished, the whole plate bracket will be collected in to the cartridge layer by layer by module components, and the loading and unloading can cache at least 6 cartridges (72 brackets), and each cartridge can independently scan the code to read the productivity parameters.

Item

Specification

Item

Specification

Adaptive element

LED whole board chip

UPH

37KPH

Component size

Length：100-180mm, Width：60-80mm

Operating efficiency

98%

Air cleanliness

Lv.5

Number of loading/unloading cartridges

6 PCS

Temperature

18-32°C

Material deformation

< 4mm

Weight

300Kg

Power

2.5kW

Power supply

AC220V±10%

Dimension

2530mm x1135mmx 1750mm

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연락처
Feel free to write and call us. We really love to communicate with our clients.
T. 051-7413915
F. 051-7413985
mail@roboalba.kr
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